during the grinding the grinding characteristics of

1 deformation complex grinding process to produce chips stacked like squeeze crack.(2) the grinding process, the grinding wheel adhesion severe adhesion loss can lead to wheel abrasive material diamond core drills  crushing and shedding.3 grinding force, grinding temperature is high, the normal force per unit width reaches 13N/mm about tangential grinding force per unit width reaches 9N/mm so. Grinding temperature reaches 650 degrees.4 high chemical activity, if titanium silicon carbide grinding wheel when the grinding action of heat, the silicon and oxygen in the air react to produce silicon oxide, the release  concrete pads of heat, so that the surface layer by layer abrasive erosion, wheel causes oxidation wear, and that react with the titanium carbide, titanium carbide, resulting in the spread of wheel wear.he main difference is the type of binding agent: resin bonded diamond grinding wheel mainly phenolic resin and a small amount of metal powder as a binder, and  tct blades electroplated diamond grinding wheel is a method by electrodeposition of nickel-cobalt alloy is deposited on the metal substrate surface and fixed to a diamond abrasive wheel production process.grinding force, grinding temperature is high, the normal force per unit width reaches 13N/mm about tangential grinding force per unit width reaches 9N/mm so. Grinding temperature reaches 650 degrees.