crystal diamond powder

Grinding, polishing process
Massive polycrystalline diamond particles and particles of single crystal diamond grinding sharp  dry core bits contrast seen sharp, shallow produce polycrystalline diamondMicro-cracks are transverse cracks (cracks at right angles with the polishing pressure) enhances the removal, its vertical microcracks (and polishing pressureDirection of the force in the same direction) the damage of its surface is limited. The overall effect is faster removal of workpiece material and the residual micro-Cracks in the  tamping rammer subsequent polishing process to remove the surface reaches a minimum. Production efficiency aside on the edge, in itsApplication process benefit is obvious, such as optical - coupler and optical components must be as transparent as possible through certain wavelengthsLight; magnetic element may interfere microcracks electronic, magnetic, or acoustic properties; polycrystalline diamond of high-precisionDegree of polishing will help you meet these requirements. Also be used for the IC chip and so on. More (poly) crystalline diamond, is a strong impulse in the explosionUnder the action of shock waves, synthetic crystals of diamond polycrystals. It is different from the production of detonation nanodiamonds.Its structure is characterized by: crystal isotropic, no cleavage plane. Not only has the unmatched hardness and strength, but wet tile saw  also has a veryHigh toughness. At the same time it does not produce fracture along the cleavage plane phenomenon. And in the grinding and polishing process will automatically peel timelyThe microscopic appearance of a new cutting edge. This "self-sharpening" ensure the machining of high precision, high efficiency and will not damage the shallowTable dimensions.